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Proposed Standardization of Chiplet Models for Heterogeneous Integration
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"Proposed Standardization of Chiplet Models for Heterogeneous Integration"

In this paper, members of the Chiplet Design Exchange (CDX) propose a set of standardized chiplet models that include properties, test models, and documentation to facilitate chiplet integration into 2.5D and 3D IC design

As general purpose chiplet providers offer their devices for use in heterogeneous package designs, manufacturers need a standardized set of design models to ensure operability in electronic design automation (EDA) design workflows. For successful industry-wide 3D IC packaging, these models should be:

  • Electronically readable for use in design workflows
  • Leverage existing industry standards that are readily available
  • Compatible across the industry, without regard for supply for an open ecosystem and supply chain


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