Wednesday, 11 January 2023, 10am ET

TI has developed a new device screening specification called space high grade in plastic (SHP) for space-qualified devices constructed in plastic packaging traditionally used in industrial applications. SHP includes both plastic substrate ball-grid array (BGA) and plastic-encapsulated packages. The SHP qualification level produces devices suitable for tough mission profiles typically served with ceramic Qualified Manufacturers List (QML) Class V devices. TI's SHP space-qualification level provides higher thermal efficiency, a smaller footprint and increased bandwidth compared to traditional ceramic packaging. The common package and pinout between the industrial- and space-grade versions enable you to get the newest technologies into your space hardware designs as soon as the commercial-grade device is sampling, because all prototyping work on the commercial product translates directly to a drop-in space-qualified SHP product when it's time to fly the system.

Speakers:

Philip Pratt, Marketing Engineer, Texas Instruments

• Philip has worked in the semiconductor industry since 1995 in various roles focused on high speed data converters including applications, design, systems and marketing. He has a bachelor's degree in electrical engineering from the University of Tennessee and a master's degree in EE from the Florida Institute of Technology. He is the marketing lead for TI's catalog high speed converters product line to the Aerospace & Defense industry.

Offered Free by: Texas Instruments
See All Resources from: Texas Instruments