Research Library

The top resource for free research, white papers, reports, case studies, magazines, and eBooks.

Share Your Content with Us
on for readers like you. LEARN MORE
Factors Affecting Interconnects in Space
Request Your Free White Paper Now:

"Factors Affecting Interconnects in Space"

Mechanical, electrical, and optical requirements for interconnects in launch vehicles and Low-Earth-Orbit (LEO) satellites.

Electronic and electrical components and their interconnects undergo extreme stress during the launch and orbit insertion of low-Earth-orbit (LEO) satellites. On LEO missions, interconnects must meet demanding requirements for vibration, electrostatic discharge, outgassing, temperature (from -270°C to 200°C), size-weight-and-power (SWAP)—and more.

What You'll Learn:

The paper examines critical factors that influence the cost and performance of interconnects in space.

  • Minimizing size and weight
  • Withstanding vibration, acoustic loads, and shock
  • Withstanding temperature extremes
  • Minimizing outgassing
  • Controlling electrostatic discharge (ESD)
  • Reducing electromagnetic permeability
  • Controlling corrosion

How TE can help

We extend our track record of developing interconnects for space that began with Surveyor lunar landers in the 1960’s to advancing space-qualified Space VPX, VITA, NASA, ESA, and MIL-SPEC compliant products today. We can help designers meet mission objectives for launch vehicles, LEO satellites, and constellations employed in today’s new space economy.

Offered Free by: TE Connectivity
See All Resources from: TE Connectivity

Recommended for Professionals Like You: