Mechanical, electrical, and optical requirements for interconnects in launch vehicles and Low-Earth-Orbit (LEO) satellites.
Electronic and electrical components and their interconnects undergo extreme stress during the launch and orbit insertion of low-Earth-orbit (LEO) satellites. On LEO missions, interconnects must meet demanding requirements for vibration, electrostatic discharge, outgassing, temperature (from -270°C to 200°C), size-weight-and-power (SWAP)—and more.
What You'll Learn:
The paper examines critical factors that influence the cost and performance of interconnects in space.
How TE can help
We extend our track record of developing interconnects for space that began with Surveyor lunar landers in the 1960’s to advancing space-qualified Space VPX, VITA, NASA, ESA, and MIL-SPEC compliant products today. We can help designers meet mission objectives for launch vehicles, LEO satellites, and constellations employed in today’s new space economy.
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